Plasma-processing-induced Damage Of Thin Dielectric Films Год выпуска: 2012Автор: He RenИздательство: LAP Lambert Academic PublishingСтраниц: 188ISBN: 9783843387583Описание In semiconductor industry, material property degradation due to process is a critical factor that limits the device performance. Process-induced damage on a variety of dielectric materials is discussed and measured. Results from various metrologies are packaged and correlated into systematic theory. Charge-induced, chemical, and physical damage source in plasma process environment is identified and optimized. Two sample types of dielectrics are investigated: high-k dielectrics used in device technology and low-k dielectrics as observed in interconnect technology.
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Марина, 06.06 Юлия, здравствуйте! Спасибо огромное за дипломную работу - защитилась на отлично! Члены ГАК задали всего два (!) вопроса по результатам исследований (что, как и почему...). Ещё раз - СПАСИБО!!!
